201903005F01W : Withdrawal: ASEK Grinding/Sawing Transferring to ATKH - NX20P5090UK WITHDRAWAL

Expanding the current flow which is currently limited to an ASE Assembly to allow for ATKH BE2 (back half of the Assembly process). The flow allows for manufacturing flexibility and helps ensure customer supply. BE2(back half of the Assembly process) (grinding/sawing/marking and Packing) will be enabled in ATKH. There's no change in Form Fit or Function.

变化的原因

Expanding the current flow which is currently limited to an ASE Assembly to allow for ATKH BE2. The flow allows for manufacturing flexibility and helps ensure customer supply.

更新信息

NXP decided to stop the NX20P5090 BE2 expansion because the current ASEK has enough capacity to support customer demands.

预期的影响

数据表的修订: No impact to existing datasheet

受影响的部分