201901014F01 : LPC5410xUK49 in WLCSP49 Package Change from Rev "B" to Rev "C"
Microcontroller products LPC5410xUK49 in WLCSP49 package will change from version "B" to version "C". Changes included a die revision to fix errata issues and an upgraded bump process.The following functional changes were made to product version "C":- IRC frequency tolerance improvement over temperature to resolve errata IRC.1 as defined in the device errata sheet.- System clock frequency improved to resolved errata Frequency.1 as defined in the device errata sheet.The following bump process changes were made to product version "C":- Under Bump Metal (UBM) and Re-Distribution Layer (RDL) change from a sputter to a plated process.- Back side protection (BSP) material changes from 40um to 25um thickness.- Overall maximum package thickness changes from 0.58mm to 0.565mm (see package drawing in attached datasheet).A revised data sheet LPC5410x v2.10 is available at https://www.nxp.com/docs/en/data-sheet/LPC5410X.pdf.
| PCN类型 | 更改类别 | 发行日期 | 生效日期 |
|---|---|---|---|
| Final Product Change Notification | Assembly materials, Assembly process, Design, Mechanical specification, Product marking | 09-Feb-2019 | 10-May-2019 |
变化的原因
1) To fix errata IRC.1 and Frequency.1.2) The sputter UBM process is outdated and has been obsoleted by the assembly vendor. The assemlby process is being ugraded to the current process already qualified by the LPC5411xUK49.
受影响产品的识别
Top side marking The change applies to product version "C" visible on the top side marking.
预期的影响
数据表的修订: A new datasheet will be issued
Product overall height is reduced by 15um due to change in back side protection thickness. Product functionality changes to fix errata issues IRC.1 and Frequency.1.
受影响的部分
| 零件号/ 12NC | 上次购买日期 | 上次交货日期 | 备件 |
|---|---|---|---|
|
LPC54101J256UK49Z (935305133019) |
- | - | - |
|
LPC54101J512UK49Z (935305135019) |
- | - | - |
|
LPC54102J256UK49Z (935305137019) |
- | - | - |
|
LPC54102J512UK49Z (935305139019) |
- | - | - |