201707002F01 : MCF5225X Fab Site Expansion (TSMC3 to NXP-CHD)
NXP Semiconductors is announcing the qualification of the NXP Chandler Arizona USA (NXP-CHD) wafer fabrication facility as a dual source wafer manufacturing location for the MCF5225X.The current mask set for product sourced out of TSMC3 Fab is identified as 1M42N.The new mask set for product sourced out of NXP-CHD Fab is identified as 0N18K.
| PCN类型 | 更改类别 | 发行日期 | 生效日期 |
|---|---|---|---|
| Final Product Change Notification | Wafer fab location | 24-Aug-2017 | 21-Nov-2017 |
变化的原因
The Fab manufacturing site capacity expansion to NXP-CHD will improve NXP's ability to meet increasing customer demand and maintain supply.
受影响产品的识别
Top side marking The mask set marking for product sourced out of TSMC3 Fab is 1M42N. The mask set marking for product sourced out of NXP-CHD Fab is 0N18K.
预期的影响
数据表的修订: No impact to existing datasheet
There is no change to product form fit function or reliability.
受影响的部分
| 零件号/ 12NC | 上次购买日期 | 上次交货日期 | 备件 |
|---|---|---|---|
|
MCF52252AF80 (935309314557) |
- | - | - |
|
MCF52252CAF66 (935309315557) |
- | - | - |
|
MCF52254AF80 (935309316557) |
- | - | - |
|
MCF52254CAF66 (935322567557) |
- | - | - |
|
MCF52255CAF80 (935309317557) |
- | - | - |
|
MCF52256AG80 (935310011557) |
- | - | - |
|
MCF52256CAG66 (935321329557) |
- | - | - |
|
MCF52256CVN66 (935313986557) |
- | - | - |
|
MCF52258AG80 (935317009557) |
- | - | - |
|
MCF52258CAG66 (935314016557) |
- | - | - |
|
MCF52258CVN66 (935313987557) |
- | - | - |
|
MCF52258CVN66J (935324336557) |
- | - | - |
|
MCF52258VN80 (935313988557) |
- | - | - |
|
MCF52259CAG80 (935309895557) |
- | - | - |
|
MCF52259CVN80 (935319401557) |
- | - | - |
|
MCF52264AF80 (935323051557) |
- | - | - |