201705011F01 : NX5P3090UK Bumping Site transfer from ChipBond to ASEK
NXP is pleased to announce product assembly migration from Chipbond to ASEK. Bumping process is same "repassivation + plated UBM + ball drop" But the bumping/assemble center change to ASEK. The Bumping process in ASEK has been released in 2016. Specific qualification tests for bumping transfer has been done on NX5P3090UK parts and all pass.old product flow: SSMC(fab) -> Chip-bond (bumping) -> ATKH (WT) -> Chip-bond (assembly)new product flow: SSMC(fab) -> ASEK (bumping) -> ATKH (WT) -> ASEK(assembly)
| PCN类型 | 更改类别 | 发行日期 | 生效日期 |
|---|---|---|---|
| Final Product Change Notification | Assembly location | 23-Jul-2017 | 21-Oct-2017 |
变化的原因
Chipbond old site closure on end Q2 2017ASEK new site production start wk1714
受影响产品的识别
Top side marking Top side Marking on Chipbond material is '5' while ASE-K is 't'.
预期的影响
数据表的修订: No impact to existing datasheet
no impactNo impact on form fit function reliability or quality.
受影响的部分
| 零件号/ 12NC | 上次购买日期 | 上次交货日期 | 备件 |
|---|---|---|---|
|
NX5P3090UKZ (935305702012) |
- | - | - |