SPC5744PEK1AMMM5 产品信息|NXP

SPC5744PEK1AMMM5

正常供应

SPC5744PEK1AMMM5

正常供应

封装


LFBGA257: LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.35 mm body

购买选项

SPC5744PEK1AMMM5

正常供应

12NC: 935364718557

详细信息

订购

从分销商处购买

工作特点

无相关信息

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
SPC5744PEK1AMMM5(935364718557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
405.3368

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5744PEK1AMMM5
(935364718557)
ISO 26262
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
SPC5744PEK1AMMM5
(935364718557)
854231
3A991A2

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5744PEK1AMMM5
(935364718557)
2025-04-162025-05-26202504009IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
SPC5744PEK1AMMM5
(935364718557)
2021-10-302021-10-31202108018IMPC5644A MPC5642A MPC563xM MPC5604P MPC5643L and MPC5744P Errata Update
SPC5744PEK1AMMM5
(935364718557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5744PEK1AMMM5
(935364718557)
2018-07-252018-10-23201806005F01MPC574xP Safety Manual Update from Rev. 3 to Rev.4
SPC5744PEK1AMMM5
(935364718557)
2018-04-132018-04-14201712018IMPC5744P Data Sheet Update to Rev 6.1