SPC5743PGK1AMMM9 产品信息|NXP

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工业

消费电子

技术

SPC5743PGK1AMMM9

正常供应

SPC5743PGK1AMMM9

正常供应
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特点

NXP 32-bit MCU, Dual core Power Arch, 2MB Flash, 256K RAM FlexR+Ethernet, 200MHz, -40/+125degC

    封装

    LFBGA257: LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.35 mm body

    购买选项

    SPC5743PGK1AMMM9

    正常供应

    12NC: 935313072557

    详细信息

    • 包装: TRAY-Tray, Bakeable, Multiple in Drypack
    • 最小封装数量: 152
    • 起订量: 760
    • 交付周期: 12 weeks
    • 预算报价（不含税）: 10K 在 US$12.40 USD

    订购

    从分销商处购买

    工作特点

    无相关信息

    环境

    部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量（mg）
    SPC5743PGK1AMMM9(935313072557)
    Yes
    Yes
    Certificate Of Analysis (CoA)
    Yes
    		D
    e2
    		REACH SVHC
    407.2

    质量

    部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度（PPT）（C°）Maximum Time at Peak Temperatures (s)
    无铅焊接无铅焊接无铅焊接
    SPC5743PGK1AMMM9
    (935313072557)
    ISO 26262
    3
    260
    40

    配送

    部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
    SPC5743PGK1AMMM9
    (935313072557)
    854231
    3A991A2

    产品变更通知

    部件/12NC发行日期生效日期产品更改通知标题
    SPC5743PGK1AMMM9
    (935313072557)
    		2021-10-302021-10-31202108018IMPC5644A MPC5642A MPC563xM MPC5604P MPC5643L and MPC5744P Errata Update
    SPC5743PGK1AMMM9
    (935313072557)
    		2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
    SPC5743PGK1AMMM9
    (935313072557)
    		2018-07-252018-10-23201806005F01MPC574xP Safety Manual Update from Rev. 3 to Rev.4
    SPC5743PGK1AMMM9
    (935313072557)
    		2018-07-062018-10-04201803011F01MPC5744P Reference Manual Update from Rev.6 to Rev.6 Addendum
    SPC5743PGK1AMMM9
    (935313072557)
    		2018-04-132018-04-14201712018IMPC5744P Data Sheet Update to Rev 6.1
    SPC5743PGK1AMMM9
    (935313072557)
    		2017-04-052017-04-06201702030IMPC57xx Flash Erase-Suspend and Erase-Abort Operation Engineering Bulletin