SPC5675KFK0MMM2 产品信息|NXP

封装


LFBGA257: LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.35 mm body

购买选项

SPC5675KFK0MMM2

正常供应

12NC: 935371937557

详细信息

订购

从分销商处购买

工作特点

无相关信息

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
SPC5675KFK0MMM2(935371937557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
D
e2
REACH SVHC
407.2

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SPC5675KFK0MMM2
(935371937557)
Quality Managed
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
SPC5675KFK0MMM2
(935371937557)
854231
3A991A2

停产和更换部件数据

部件/12NC停产通知上次购买日期上次发货日期替代器件
SPC5675KFK0MMM2
(935371937557)
NOTICE
2020-08-31
2020-11-30
-

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SPC5675KFK0MMM2
(935371937557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SPC5675KFK0MMM2
(935371937557)
2020-03-202020-03-21201908018DNU01Cancellation of Discontinuation Notification For MPC5675K 257MAPBGA With 0.7mm Mold Cap Height
SPC5675KFK0MMM2
(935371937557)
2019-12-032019-12-04201908018DNDiscontinuation Notification For MPC5675K 257MAPBGA With 0.7mm Mold Cap Height