SCIMX6QP6AVT8AB 产品信息|NXP

SCIMX6QP6AVT8AB

正常供应

SCIMX6QP6AVT8AB

正常供应

封装


FBGA624: FBGA624; plastic, fine-pitch ball grid array; 624 bumps; 0.8 mm pitch; 21 mm x 21 mm x 2 mm body

购买选项

SCIMX6QP6AVT8AB

正常供应

12NC: 935387282557

详细信息

订购

工作特点

无相关信息

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
SCIMX6QP6AVT8AB(935387282557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
2381.425

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
无铅焊接无铅焊接无铅焊接
SCIMX6QP6AVT8AB
(935387282557)
No
3
260
40

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)CCATS
SCIMX6QP6AVT8AB
(935387282557)
854231
5A992
G159000

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
SCIMX6QP6AVT8AB
(935387282557)
2025-04-162025-05-26202504009IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
SCIMX6QP6AVT8AB
(935387282557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
SCIMX6QP6AVT8AB
(935387282557)
2019-07-142019-07-15201805041IU01iMX6DQ+ iMX6DQ iMX6SDL iMX6SL iMX6SX Reference Manual Updates