MCIMX6DP5EVT2AB 产品信息|NXP

MCIMX6DP5EVT2AB

正常供应

MCIMX6DP5EVT2AB

正常供应

特点


    封装


    FBGA624: FBGA624; plastic, fine-pitch ball grid array; 624 bumps; 0.8 mm pitch; 21 mm x 21 mm x 2 mm body

    购买选项

    MCIMX6DP5EVT2AB

    正常供应

    12NC: 935363577557

    详细信息

    数量

    单价

    1 - 25$63.61
    26 - 99$58.72
    100+$53.82

    订购

    $63.61 USD
    现货:600
    从分销商处购买

    工作特点

    无相关信息

    环境

    部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
    MCIMX6DP5EVT2AB(935363577557)
    Yes
    Yes
    Certificate Of Analysis (CoA)
    Yes
    DREACH SVHC
    5931.947

    质量

    部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
    无铅焊接无铅焊接无铅焊接
    MCIMX6DP5EVT2AB
    (935363577557)
    No
    3
    260
    40

    配送

    部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)CCATS
    MCIMX6DP5EVT2AB
    (935363577557)
    854231
    5A992C
    G159000

    产品变更通知

    部件/12NC发行日期生效日期产品更改通知标题
    MCIMX6DP5EVT2AB
    (935363577557)
    2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
    MCIMX6DP5EVT2AB
    (935363577557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
    MCIMX6DP5EVT2AB
    (935363577557)
    2019-07-142019-07-15201805041IU01iMX6DQ+ iMX6DQ iMX6SDL iMX6SL iMX6SX Reference Manual Updates
    MCIMX6DP5EVT2AB
    (935363577557)
    2019-05-082019-05-09201805041IiMX6DQ+ iMX6DQ iMX6SDL iMX6SL iMX6SX Reference Manual Updates