Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
封装
LQFP64: LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body
购买选项
MC9S12XS128MAE
正常供应
12NC: 935314014557
详细信息
订购
工作特点
| 参数 | 值 |
|---|---|
Flash (kB) | 128 |
RAM (kB) | 8 |
EEPROM (kB) | 8 |
ADC | 1 |
ADC (bits) | 8 |
Operating Frequency [Max] (MHz) | 40 |
| 参数 | 值 |
|---|---|
CAN | 1 |
SPI | 1 |
Supply Voltage [max] (V) | 5.5 |
Supply Voltage [min] (V) | 3.13 |
Ambient Operating Temperature (Min to Max) (℃) | -40 to 125 |
GPIO | 44 |
环境
| 部件/12NC | 无铅 | 欧盟 RoHS | 无卤素 | RHF指标 | 二级互连 | REACH SVHC | 重量（mg） |
|---|---|---|---|---|---|---|---|
MC9S12XS128MAE(935314014557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e4 | REACH SVHC | 346.55 |
质量
| 部件/12NC | 安全保障功能安全 | 湿度灵敏度等级(MSL) | 封装体峰值温度（PPT）（C°） | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| 无铅焊接 | 无铅焊接 | 无铅焊接 | |||||
MC9S12XS128MAE (935314014557) | No | 3 | 260 | 40 | |||
配送
| 部件/12NC | 协调关税 (美国)免责声明 | 出口控制分类编号 (美国) |
|---|---|---|
MC9S12XS128MAE (935314014557) | 854231 | 3A991A2 |
产品变更通知
| 部件/12NC | 发行日期 | 生效日期 | 产品更改通知 | 标题 |
|---|---|---|---|---|
MC9S12XS128MAE (935314014557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MC9S12XS128MAE (935314014557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
更多信息 S12XS
The S12XS 16-bit MCU family is optimized for a broad range of cost-sensitive automotive body electronics applications.
Addressing customer needs for design flexibility and platform compatibility, the S12X products enable scalability, hardware and software reusability and compatibility across a broad array of automotive electronics platforms.
The S12XS automotive MCU family allows you to quickly react to market opportunities while reducing the cost of migration if application requirements change during your development cycle.
Compact packaging makes these devices suitable for space-constrained applications, such as small actuators, sensor modules and column-integrated modules.