MC9328MXLCVP15 产品信息|NXP

MC9328MXLCVP15

使用寿命终止

MC9328MXLCVP15

使用寿命终止

特点


DRAGONBALL MXL 225 PB-FR

    封装


    LFBGA225: LFBGA225, plastic, low profile fine-pitch ball grid array; 225 balls; 0.8 mm pitch; 13 mm x 13 mm x 1.6 mm body

    购买选项

    MC9328MXLCVP15

    使用寿命终止

    12NC: 935319011557

    详细信息

    订购

    从分销商处购买

    工作特点

    无相关信息

    环境

    部件/12NC无铅欧盟 RoHS无卤素RHF指标二级互连REACH SVHC重量(mg)
    MC9328MXLCVP15(935319011557)
    Yes
    Yes
    Certificate Of Analysis (CoA)
    Yes
    D
    e1
    REACH SVHC
    435.4

    质量

    部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)Maximum Time at Peak Temperatures (s)
    无铅焊接无铅焊接无铅焊接
    MC9328MXLCVP15
    (935319011557)
    No
    3
    260
    40

    配送

    部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
    MC9328MXLCVP15
    (935319011557)
    854231
    3A991A2

    产品变更通知

    部件/12NC发行日期生效日期产品更改通知标题
    MC9328MXLCVP15
    (935319011557)
    2025-04-162025-05-26202504007IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
    MC9328MXLCVP15
    (935319011557)
    2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
    MC9328MXLCVP15
    (935319011557)
    2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments