LPC55S66BD100 产品信息|NXP

LPC55S66BD100

正常供应

LPC55S66BD100

正常供应

封装


HLQFP100: HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.4 mm body

购买选项

LPC55S66BD100/CP3K

正常供应

12NC: 935392625557

详细信息

订购

工作特点

无相关信息

环境

部件/12NC无铅欧盟 RoHS无卤素RHF指标REACH SVHC重量(mg)
LPC55S66BD100/CP3K(935392625557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
644.0319512424068

质量

部件/12NC安全保障功能安全湿度灵敏度等级(MSL)封装体峰值温度(PPT)(C°)
铅焊接无铅焊接铅焊接无铅焊接
LPC55S66BD100/CP3K
(935392625557)
No
3
3
240
260

配送

部件/12NC协调关税 (美国)免责声明出口控制分类编号 (美国)
LPC55S66BD100/CP3K
(935392625557)
854231
5A992C

产品变更通知

部件/12NC发行日期生效日期产品更改通知标题
LPC55S66BD100/CP3K
(935392625557)
2022-06-012022-09-05202205023IStandardize the LQFP 14x14x1.4 tray and the 5+1 Tray Dry-Pack Packing Method
LPC55S66BD100/CP3K
(935392625557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label