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DEVICE MIGRATION
Generic Copy
ISSUE DATE:18-Dec-2014
NOTIFICATION:16576
TITLE:MC07XS6517EK, MC17XS6500EK Device Migration With Copper Wire Qualification
LAST BUY DATE:26-Dec-2015
LAST SHIP DATE:25-Dec-2016


DEVICE(S)
MPNREPLACEMENT MPNREPLACEMENT TYPEREPLACEMENT REASON
MC07XS6517EKMC07XS6517EK Replaced BY MC07XS6517BEKSame Form, Fit & Function, Pin-for-Pin EquivalentDesign Change,Bill of Material Change (same assembly site)
MC07XS6517EKR2MC07XS6517EKR2 Replaced BY MC07XS6517BEKR2Same Form, Fit & Function, Pin-for-Pin EquivalentDesign Change,Bill of Material Change (same assembly site)
MC17XS6500EKMC17XS6500EK Replaced BY MC17XS6500BEKSame Form, Fit & Function, Pin-for-Pin EquivalentDesign Change,Bill of Material Change (same assembly site)
MC17XS6500EKR2MC17XS6500EKR2 Replaced BY MC17XS6500BEKR2Same Form, Fit & Function, Pin-for-Pin EquivalentDesign Change,Bill of Material Change (same assembly site)

AFFECTED CHANGE CATEGORIES
  • BILL OF MATERIAL CHANGE (SAME ASSEMBLY SITE)

  • DESIGN CHANGE


    • DESCRIPTION OF CHANGE

    Freescale Semiconductor announces the device migration of MC07XS6517EK and MC17XS6500EK to MC07XS6517BEK and MC17XS6500BEK which incorporate the latest revision of control die design pass 2.0 and Palladium Copper (PdCu) wire as a wirebond material, along with modified die attach, mold compound and leadframe, as described below. These products are now qualified for assembly at Freescale Tianjin Final Manufacturing (TJNFM) site, Tianjin China. These products were previously assembled with Gold (Au) wire for the control die and power die inter-bonds, and Aluminum (Al) wire for the remaining power die bonds.

    The changes to die attach and mold compound are required to standardize the bill of materials for TJNFM ESOIC package current production. Enhanced leadframe are deployed to improve manufacturability and robustness of the package. The power die non-interbonds remain in Aluminum (Al).

    The new parts are backward compatible to the original parts and do not impact the form, fit, function or reliability of the device. Customers should begin planning for conversion based on the last order date and last ship date listed above.
     
    MC07XS6517BEK and MC17XS6500BEK are the recommended replacement in all applications.
     
    Current Part Number
    New Part Number
    LPN
     
    Current Control die design
     
    New Control die design
    Package
    Current Wire
    New Wire
    Current LF
    (P/N)
    New LF
    (P/N)
    Current Control Die attach
    New Control Die Attach
    Current  Mold Compound
    New Mold Compound
    MC17XS6500EK
    MC17XS6500BEK
    P17
     
    GEN4 1.4
     
    GEN4 2.0
    ESOIC32
    Au /
    1.3 mils
    PdCu/
    1.3 mils
    17ASA00095D604
     
    17ASA00095D003
    ABP8910T
    2025D
    HF13
    G630AY
    MC07XS6517EK
    MC17XS6500BEK
    T017D17
     
    GEN4 1.4
     
    GEN4 2.0
    ESOIC54
    Au /
    1.3 mils
    PdCu/
    1.3 mils
    17ASA0096D601
    No change
    ABP8910T
    2025D
    G630AY
    No change
     



    REASON FOR CHANGE

    Freescale is offering the enhanced MC07XS6517BEK and MC17XS6500BEK with latest revision of control die design and assembly bill of material to mitigate against raw material cost increases and for supply assurance.



    ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

    Replacement parts have same Form, Fit, Function and Reliability



    Freescale will consider specific conditions of acceptance of this change submitted within 30 days of receipt of this notice on a case by case basis. To request further data or inquire about the notification, please enter a Service Request.

    For sample inquiries - please go to www.freescale.com


    RELATED NOTIFICATION(S):
    P16441- ESWITCH DEVICES COPPER WIRE QUALIFICATION (ESOIC 32 AND ESOIC 54)

    TO VIEW the GENERIC copy, click on the notification number above.
    QUAL DATA AVAILABILITY DATE:     05-Dec-2014

    QUALIFICATION STATUS:     COMPLETED

    QUALIFICATION PLAN:

        N/A

    RELIABILITY DATA SUMMARY:

    Please find attached the MC07XS6517BEK/MC17XS6500BEK and eSOIC package palladium copper (Pd Cu) qualification results.



    ELECTRICAL CHARACTERISTIC SUMMARY:

        N/A

    CHANGED PART IDENTIFICATION:

        N/A

    SAMPLE AVAILABILITY DATE: 26-Dec-2014


    ATTACHMENT(S):
    External attachment(s) FOR this notification can be viewed AT:
    16576_MC07XS6517BEK_and_MC17XS6500BEK_qualification_results_GPCN.pdf
    16576_ESOIC_copper_wire_qualification_results_GPCN.pdf
    16576_ESOIC_Copper_wires_qualification_strategy_GPCN.pdf
    16576_ESOIC_MC07XS6517BEK_and_MC17XS6500BEK_CofDC_Compare_GPCN.pdf
    16576_DeQuMa_MC07XS6517BEK_and_MC17XS6500BE_qualification_GPCN.pdf
    16576_Device_Migration_Specification_Change_Summary_GPCN.pdf