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PRODUCT AND PROCESS CHANGE NOTIFICATION
Generic Copy
ISSUE DATE:01-Aug-2014
NOTIFICATION:16371
TITLE:MC33926PNB H-Bridge Copper Wire and Die Revision Qualification
EFFECTIVE DATE:28-Jan-2015

DEVICE(S)
MPN
MC33926PNB
MC33926PNBR2

AFFECTED CHANGE CATEGORIES
  • BILL OF MATERIAL CHANGE (SAME ASSEMBLY SITE)

  • DESIGN CHANGE


    • DESCRIPTION OF CHANGE

    Freescale Semiconductor announces the addition of Copper (Cu) wire as a wirebond material and silicon die revision for the MC33926PNB H-Bridge devices associated with this notification. Previously, these devices were qualified at Freescale-Tianjin Final Manufacturing site (TJNFM) using Gold (Au) wire bonding and a previous silicon die revision. These devices are now qualified at Freescale-Tianjin (TJN) using Cu (Copper) wire bond and new die revision.

    Samples are available for KC33926PNB.



    REASON FOR CHANGE

    The transfer from Gold to Copper wire is required to mitigate against raw material cost increases and for supply assurance.
    Update silicon revision for better product performance. Increasing the gate stress voltage allows for improved stressing of the power outputs during ATE testing.



    ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

    No change to form, fit or function. Reliability is equivalent or improved.



    According to JEDEC Standard JESD46, lack of acknowledgement of this PCN within 30 days will be considered acceptance of change. To request further data or inquire about the notification, please enter a Service Request.

    For sample inquiries - please go to www.freescale.com

    QUAL DATA AVAILABILITY DATE:     18-Jul-2014

    QUALIFICATION STATUS:     COMPLETED

    QUALIFICATION PLAN:

    See attached.



    RELIABILITY DATA SUMMARY:

    See attached.



    ELECTRICAL CHARACTERISTIC SUMMARY:

    See attached.



    CHANGED PART IDENTIFICATION:

    There is no change to orderable part number. The tracecode marking on the device includes assembly site and datecode. Freescale will have traceability by assembly site and datecode.
     



    SAMPLE AVAILABILITY DATE: 18-Jul-2014


    ATTACHMENT(S):
    External attachment(s) FOR this notification can be viewed AT:
    16371_H-Bridge_Copper_Wire_Electrical_Distribution_GPCN.pdf
    16371_H-Bridge_Copper_Wire_Qualification_Results_GPCN.pdf