ISSUE DATE: | 14-May-2014 |
NOTIFICATION: | 16188 |
TITLE: | MPC5643L/MPC5634M CU WIRE QUALIFICATION |
EFFECTIVE DATE: | 12-Aug-2014 |
MPN |
---|
SPC5634MF1MMG80 |
SPC5634MF1MMGX1 |
SPC5634MF1MMGX2 |
SPC5634MF1MMGX3 |
SPC5634MF2MMG80 |
SPC5634MF2MMGX1 |
SPC5643LF2MMM1 |
SPC5643LF2MMM1R |
SPC5643LFF2MMM1 |
Freescale Semiconductor announces the addition of Copper Wire as a wirebond material for the devices listed in the PCN. These products are currently assembled with Gold wire at Freescale TJN assembly site, Tianjin, China.
The change to Copper Wire also includes a change in wire diameter.
WIRE | |
Original | New |
Au 23um | Pd Cu 20um |
The transfer from Gold to Copper is required to mitigate against raw material cost increases and for supply assurance.
Wire composition and wire diameter are the only change to form. No impact to fit or function. Reliability is equivalent or improved.
See attached qualification results.
See attached qualification results.
No change to datasheet. Electrical Distribution comparison, Gold wire versus Copper wire included in this notification. Result shows no difference in Electrical Distributions.
There is no change to orderable part number. The Tracecode marking on the device includes assembly site and datecode. Freescale will have traceability by assembly and datecode.
The table below provides sample part numbers:
Au Part Number
|
Cu Sample Part Number
|
Package
|
SPC5634MF2MMG80
|
KPC5634MF2MMG80
|
MAPBGA 208 17*17*0.8P1.0
|