Freescale Semiconductor has qualified a modification to the test process flow. This change will include the removal of room test from the production test program for all MC9S12D64 family ATMC devices (maskset: 0M89C). This change does not impact cold or hot test flow as part of final test in production. This product is currently processed in FSL-ATMC-Fab. This evaluation was completed using Freescale standard specifications and approved by Reliability and Quality Engineering.

Original Production Test Flow:
Probe – Burn In - Cold Final Test - HOT Final Test - Room Final Test - In-Line QA Gate Tests.

New Production Test Flow:
Probe – Burn In - Cold Final Test - Hot Final Test - In-Line QA Gate Test.

Products processed on the new test flow will have a ship date after the effective date of this PCN. Please contact local sales office for additional information.

Promotes flexible capacity and improves delivery assurance.

None

Requirement: Achieve 0 room temperature test failures out of at least 100,000 units tested to the proposed production Final Test flow.

Evaluation Process: Test at least 100,000 units through COLD Final Test, HOT Final Test, and ROOM Final Test.   Parts will be from at least 12 wafer lots that have been processed in wafer fab over a minimum period of 9 weeks.

Achieve 0 ROOM Final Test failures. 

Qualification was carried out successfully for 136,818 units, representing 28 different wafer lots processed in the same fabrication facility, with 0 failures at the ROOM Final Test insert.

The room test elimination was successfully completed after testing 136,818 units, representing 28 different wafer lots from ATMC-FAB, with zero failures.

This device is MC qualified and no process changes were performed. No additional electrical characterization was required.

There will be no change to the orderable part numbers.