Freescale Semiconductor is pleased to announce the expansion of internal unit probe capability at our Kuala Lumpur Final Manufacturing (KLM) location. Following the completion of the correlation and qualification process, KLM will be considered an alternate probe site for the Freescale products listed on the affected parts list. All flows, processes, and operating procedures will be equivalent to those used at the sending probe site. Hardware, software and process documentation are identical between sites. This change will support an alignment of probe with the assembly and test operations. This project will begin immediately and from Q3, 2007, forward, customers could receive product from this Freescale-qualified probe site. This project is scheduled for completion in January, 2008. Wafer probe is an interim check of product performance to maximize and improve efficiency of resources at the assembly and final test operations. Final test is the arbiter of quality for packaged Freescale products,and there will be no changes to the final test process as a result of this project. This notification does not affect any devices sold as die, wafers, bumped, or flip chip products. Wafer probe site is not marked on products, and so no marking changes will be seen. By qualifying KLM as an additional source for backgrind and probe, we improve our ability to meet customers needs. An example of successful correlation is shown below. All subsequent correlations will be conducted in the same manner and be subject to the same pass/fail criteria. A transfer schedule by product and all correlation data will be available upon request.

ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

Freescale will consider specific conditions of acceptance of this change submitted within 30 days of receipt of this notice on a case by case basis. To request further data or inquire about samples, please enter a Service Request.

Backgrind Temperature Cycle (TC) with Preconditioning, -55 to 125C, 500 Cycles 3 lots x 77 units per package, per product package Highly Accelerated Stress Test (HAST)with Preconditioning, 130C/85%RH/33.3PSIG/nominal bias, 96 Hours (actual conditions may vary) 3 lots x 77 units Probe All products will receive: Test------------------Detail--------------------Acceptance criteria Pass/fail correlation-Bin and yield correlation-<3percent difference 1 probe card, 3 wafers per product Parametric correlation-All critical parameters-<10percent difference Gauge R&R------------Bin and die repeatability-<10percent difference 3 probe cards per product Probe Mark Inspection--Bond pad damage inspection--No passivation 1 wafer per product cracks All correlation and qualification data will be available upon completion.

Backgrind: Temperature Cycle (TC) w/MSL3 PC, -55 to 125C, 500 Cycles TEPBGA package Lot1 0/77 Lot2 0/77 Lot3 0/77 Pass Highly Accelerated Stress Test (HAST) or equivalent w/MSL3 PC, 130C/85%RH/33.3PSIG/nominal bias, 96 Hours (actual conditions may vary) 3 lots x 77 units TEPBGA package Lot1 0/77 Lot2 0/77 Lot3 0/77 Pass Probe: Pass/fail correlation HC908AB32A Product Pass Parametric correlation HC908AB32A Product Pass Gage R&R MC908AB32A Product Pass Probe Mark Inspection HC908AB32A Product Pass Similar correlation data will be collected as product families are qualified, but additional notifications will not be issued. Full correlation reports are available upon request.

No changes to device function or performance.

N/A