After the Maker Board Phase: Smoother From Development to Manufacturing Based on an i.MX 8M Plus Solution MBa8MP-RAS314 | NXP 半导体

设计中心
培训
After the Maker Board Phase: Smoother From Development to Manufacturing Based on an i.MX 8M Plus Solution MBa8MP-RAS314

After the Maker Board Phase: Smoother From Development to Manufacturing Based on an i.MX 8M Plus Solution MBa8MP-RAS314

About This Training

All over the world, over 20 cybersecurity regulations aim to ensure OEMs provide better, safer, and more secure IoT products in the market. Security protection is no longer an afterthought.

IoT device makers are required to implement cyberattack countermeasures and manage vulnerabilities starting from the design stage until the end of the product life cycle. In this webinar, we will discuss some essential cybersecurity requirements for IoT products and how to address them with NXP security technologies.

Presentation

After the Maker Board Phase: Smoother From Development to Manufacturing Based on an i.MX 8M Plus Solution MBa8MP-RAS314

What You Will Learn

Software that enables easy migration
Advanced functionality and performance
Long-term availability
Industrial passive cooling solution
Application Example WiFi Hot Spot Gateway

Presented by

Konrad Zöpf
Deputy Director TQ Embedded, Product Management, TQ Systems
Sai Kancharla
i.MX Product manager, NXP Semiconductors
Markus Niebel

TQ Software Development

时长

1 hr 2 min

语言

英语

技术级别

初级

0观看次数1赞

我们致力于不断提升。

欢迎参加调查问卷。

Additional Resources

i.MX 8M Plus – Arm® Cortex®-A53, Machine Learning, Vision, Multimedia and Industrial IoT

Stay In the Loop

Subscribe to our newsletter to stay updated with our latest developments and if you need further assistance, we are here to help.

Subscribe Contact Support